Lead-free solder paste 138°C low temperature customized for high-end motherboard repair RELIFE RL- 404

Lead-free solder paste 138°C low temperature customized for high-end motherboard repair RELIFE RL- 404

4.5 3 отзыва 11 заказов

200 руб.

Описание

Бессвинцовая паяльная паста 138 °C низкая температура настроена для ремонта материнской платы высокого класса RELIFE RL-404

Lead-free solder paste 138°C low temperature customized for high-end motherboard repair RELIFE RL- 404

Lead-free solder paste 138°C low temperature customized for high-end motherboard repair RELIFE RL- 404

Lead-free solder paste 138°C low temperature customized for high-end motherboard repair RELIFE RL- 404

Lead-free solder paste 138°C low temperature customized for high-end motherboard repair RELIFE RL- 404

Lead-free solder paste 138°C low temperature customized for high-end motherboard repair RELIFE RL- 404

Lead-free solder paste 138°C low temperature customized for high-end motherboard repair RELIFE RL- 404

Характеристики

Particle Size: 1-10μm

Model Number: for iphonex / For iphoneX BGA Reballing F

Application: For iphoneX Circuit Board P

Application1: Repair mainboard Location

Application2: For iphoneX Special solder paste

type: rl-404